Thermal Conductive Adhesive Tape

Features：

Reduce thermal resistance, accelerate heat transfer, and improve heat dissipation performance

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Product structure:

‍Double-side Thermal Conductive Adhesive Tape

‍Release Liner | Release film

Thermal Interface Layer | Pressure-sensitive adhesive thermal interface layer

Carrier / Substrate | PI film

Thermal Interface Layer | Pressure-sensitive adhesive thermal interface layer

Release Liner | Release film

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Evaluate performance before production. Optimized for performance, consistency, and manufacturability.
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sales.novabridge@gmail.com
+1 (949) 508-6070